• PRODUCTS
    PRODUCTS
    Through continuous technology development and innovation, the company has more than 100 pieces of independent intellectual property rights and patents in core areas such as lidar transmitting and receiving chips, system device and ranging implementation methods.
  • INDUSTRIES
    INDUSTRIES
    The company’s core business is mainly divided into two parts. One is the development and production of the vehicle solid-state lidar system and its core chip, the other one is the development and production of 3D sensor and its core chip for consumer electronics. ABAX is committed to provide users with integrated solutions with 3D TOF receiving array chips as the core.
  • TECHNICAL SUPPORT
  • NEWS
    NEWS
    ABAX is committed to provide users with integrated solutions with 3D TOF receiving array chips as the core. The product is mainly used in many intelligent fields such as automatic drive, smartphone and security.
  • CAREER
  • ABOUT US
    ABOUT US
    Ningbo ABAX Sensing Electronic Technology Co., Ltd. was founded in 2016, which is a high-tech company focusing on the research and development of optoelectronic devices, lidar and its core chips. In 2019, the company moved to Ningbo and retained Xi'an as an independent wholly-owned subsidiary company.
3D TOF Sensor - DTOF serial products
Product Description
Features
Product Description

D001 is a Direct Time-of-Flight (DTOF) depth image sensor with independent pixel design patent, featuring high precision, high resolution, low power consumption, small pixel size etc. The chip adopts global shutter with a pixel array resolution of 100×80, the actual resolution of which dependents on the resolution of the transmitting end faculae. The chip uses SPAD array for single-photon ranging to ensure a detection distance of at least 5m when the emission average power is greatly reduced to 15mW. A high-precision clock less than 70ps is provided inside the chip to ensure that the ranging accuracy is less than 1cm (or <1% uncertainty).

Features

● Pixel size: 25μm x 25μm

● Resolution :100×80

● Chip size:2.5mm×2.0mm

● Frame rate:30fps

● Accuracy:1cm or <1%

● Silicon substrate